Adhesiveless FCCL
Feature of Product
It has the characteristics of high temperature resistance, high insulation and high deflection. Widely used in FPC manufacturing.
Product ingredients
The flexible copper clad substrate (FCCL) is composed of three materials: copper foil, adhesive and PI film through high-precision coating technology.
- Consult More
- Physical Properties
Adhesiveless FCCL
Feature of Product
It has the characteristics of high temperature resistance, high insulation and high deflection. Widely used in FPC manufacturing.
Product ingredients
The flexible copper clad substrate (FCCL) is composed of three materials: copper foil, adhesive and PI film through high-precision coating technology.
- Consult More
- Physical Properties
Adhesive FCCL
Feature of Product
It has the characteristics of high temperature resistance, high insulation and high deflection. Widely used in FPC manufacturing.
Product ingredients
The flexible copper clad substrate (FCCL) is composed of three materials: copper foil, adhesive and PI film through high-precision coating technology.
- Consult More
- Physical Properties
Adhesiveless FCCL
Feature of Product
It has the characteristics of high temperature resistance, high insulation and high deflection. Widely used in FPC manufacturing.
Product ingredients
The flexible copper clad substrate (FCCL) is composed of three materials: copper foil, adhesive and PI film through high-precision coating technology.
- Consult More
- Physical Properties
FCCL Materials
The flexible copper clad substrate (FCCL) is composed of three materials: copper foil, adhesive and PI film through high-precision coating technology. It has the characteristics of high temperature resistance, high insulation and high deflection. Widely used in FPC manufacturing.
Application Field
Military products
Aerospace
Digital product
F. Class H motor cable
Computer
Communication equipment
